DocumentCode
1328686
Title
Packaged hybrid integrated phased-array multi-wavelength laser
Author
Van Thourhout, D. ; Van Hove, A. ; Van Caenegem, T. ; Moerman, I. ; Van Daele, P. ; Baets, R. ; Leijtens, X.J.M. ; Smit, M.K.
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Belgium
Volume
36
Issue
5
fYear
2000
fDate
3/2/2000 12:00:00 AM
Firstpage
434
Lastpage
436
Abstract
A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of <1 MHz were measured
Keywords
III-V semiconductors; indium compounds; integrated optics; semiconductor device packaging; semiconductor laser arrays; semiconductor optical amplifiers; 1 MHz; 1.6 GHz; InP; InP components; UV-curable epoxy; bandwidth; chips; commercial laser module; hybrid integrated phased-array multi-wavelength laser; hybrid integration technology; linewidth; multi-wavelength laser; packaged hybrid integrated phased-array multi-wavelength laser; phased-array multi-wavelength laser; six-channel multiwavelength laser;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20000385
Filename
840084
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