DocumentCode :
13294
Title :
Popcorn Cavity Pressure
Author :
Shirley, C. Glenn
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
Volume :
14
Issue :
1
fYear :
2014
fDate :
Mar-14
Firstpage :
426
Lastpage :
431
Abstract :
The evolution of the moisture concentration profile and cavity pressure in response to sudden exposure to a reflow ambient is shown for the simplest model of a plastic package with cavity. Careful definition of boundary conditions, particularly of the mass balance at the molding compound/cavity interface, shows that a superposition of two classical solutions to the diffusion equation for a specific class of boundary conditions is necessary. The boundary condition analysis also points the way to modeling cavity pressure correctly in more complicated and realistic cases. The zero cavity size limit of the analytical solution is interesting because it shows, contrary to common belief, that a cavity is not necessary for the existence of very high internal pressures to cause mechanical damage.
Keywords :
moulding; plastic packaging; reflow soldering; boundary conditions; cavity interface; diffusion equation; mass balance; mechanical damage; moisture concentration profile; molding compound; plastic package; popcorn cavity pressure; reflow ambient; zero cavity size limit; Boundary conditions; Cavity resonators; Compounds; Mathematical model; Moisture; Semiconductor device modeling; Slabs; Plastic integrated circuit packaging; reliability;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2013.2282301
Filename :
6601676
Link To Document :
بازگشت