Deposition of Inclined Orientation Film Using Collimated Sputtering

Aiming at realization of inclined anisotropy film for high density bit patterned media, collimated sputtering was investigated for stacked films. Using an appropriate collimator diameter with oblique incidence at 60°, deflection angle of as large as 8 degrees was obtained for Co-Cr films deposited on a Ta/Pt/Ru underlayer. The angle may be increased and even a relatively small angle of around 10° is expected to increase the write shift margins of BPM. Collimated sputtering was confirmed to be useful to deposit inclined orientation films.