DocumentCode :
1331656
Title :
Performance of microbolometer focal plane arrays under varying pressure
Author :
He, X. ; Karunasiri, G. ; Mei, T. ; Zeng, W.J. ; Neuzil, P. ; Sridhar, U.
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
Volume :
21
Issue :
5
fYear :
2000
fDate :
5/1/2000 12:00:00 AM
Firstpage :
233
Lastpage :
235
Abstract :
In this letter, we present a study of imaging using a 128/spl times/128-pixel microbolometer focal plane array (FPA) under varying pressure conditions from 10/sup -5/ torr to the ambient. We have employed bulk micromachining in the fabrication of FPA to reduce the thermal conduction through the air-gap between the membrane and the substrate of the microbolometers. It was found that an image of a soldering iron (200/spl deg/C) was clearly visible even at the ambient pressure. However, at ambient pressure, the increased in thermal conductance resulted in a reduction of contrast of the image compared to the ones obtained at low pressure. The results suggest the possibility of operation of uncooled FPA´s under ambient pressure by proper design of the microbolometer structure.
Keywords :
bolometers; focal planes; heat conduction; micromachining; microsensors; 128 pixel; 16384 pixel; 1E-5 to 760 torr; 200 C; bulk micromachining; image contrast; membrane substrate air gap; microbolometer focal plane arrays; microbolometer structure design; soldering iron image; thermal conductance; thermal conduction reduction; uncooled FPA; varying pressure conditions; Air gaps; Biomembranes; Bolometers; Circuits; Fabrication; Micromachining; Resistors; Switches; Thermal conductivity;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.841306
Filename :
841306
Link To Document :
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