A Practical Crosstalk Reduction Technique Applied to High-Density Hard Disk Interconnecting Assembly Traces

A novel electromagnetic (EM) decoupling and crosstalk reduction technique applied to hard disk drive is presented. Grooves are introduced with different depths between conductors of the trace suspension assembly interconnects (TSAI). By using commercial EM simulation software, an induced voltage from an unwanted external field on TSAI is reduced in relation with groove depth. As much as 12.5-dB decoupling is observed for 25%-75% groove depths. The crosstalk reduction obtained over 1.0 dB for 1-4 GHz frequency band is achieved and the transmission bandwidth has increased by 20% at 75% groove depth. Hence, additional grooves will strengthen the immunity of TSAI at the reader sensor against external field disturbances as well as offer an improved transmission performance.