Title :
Critical Thickness of (001) Texture Induction in FePt Thin Films on Glass Substrates
Author :
Mei, J.K. ; Yuan, F.T. ; Liao, W.M. ; Sun, A.C. ; Yao, Y.D. ; Lin, H.M. ; Hsu, J.H. ; Lee, H.Y.
Author_Institution :
Dept. of Mater. Eng., Tatung Univ., Taipei, Taiwan
Abstract :
Development of (001) texture in FePt thin films deposited on glass substrates with different thickness (t) treated by rapid thermal annealing (RTA) is studied. A critical thickness of 30 nm is characterized: below which the (001) preferred orientation of the films develops with increasing t ; when t >; 30 , the films become isotropic. Remarkable perpendicular anisotropy in magnetic properties is achieved in the 30 nm thick sample with the best (001) texture. Discontinuous changes are also observed in surface morphology, microstructure, magnetic domain structure, and internal stress. Direct evidences are presented relating the formation of (001) texture to abnormal grain growth. The internal stress/strain analysis indicates that the residual tensile (σ) stress is proportional to the degree of (001) preferred orientation. A large value of σ of about 8.9 GPa is obtained in the film with t = 30, suggesting the driving force forming the texture.
Keywords :
ferromagnetic materials; grain growth; internal stresses; iron alloys; magnetic domains; magnetic structure; magnetic thin films; metallic thin films; perpendicular magnetic anisotropy; platinum alloys; rapid thermal annealing; stress-strain relations; surface morphology; tensile strength; texture; (001) texture induction; FePt; SiO2; critical thickness; glass substrates; grain growth; internal stress-strain analysis; magnetic domain structure; magnetic properties; microstructure; perpendicular anisotropy; preferred orientation; rapid thermal annealing; residual tensile stress; size 30 nm; surface morphology; thin films; Anisotropic magnetoresistance; Glass; Internal stresses; Magnetic domains; Microstructure; Strain; Substrates; Magnetic thin films; magnetic materials;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2011.2158191