Operating parameter based wirebond model for a power module

Lifetime estimation of power semiconductors for various applications has gained technical importance. The main failures in high power semiconductors are caused by thermo-mechanical fatigue, mainly in solder and wirebonds, due to different coefficients of thermal expansions of the various packaging materials. Most of the lifetime models do not take all the operating parameters into account. There is a need to develop a generalized lifetime model specific to failure mechanisms that account for all of the operating parameters in an application. This paper presents finite element based stress simulations for varying operating parameters (current, temperature, etc.) for a fixed dimension wire.