Title :
Electrical characteristics of interconnections for high-performance systems
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
2/1/1998 12:00:00 AM
Abstract :
A review is presented of the electrical characteristics of high-density, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed
Keywords :
crosstalk; delays; integrated circuit interconnections; integrated circuit packaging; transmission lines; wiring; ceramic carriers; coupled transmission lines; electrical characteristics; high-density interconnections; high-performance systems; lossy transmission lines; on-chip wiring; performance-limiting parameters; printed circuit boards; shielded cables; short-pulse propagation technique; thin-film wiring; wiring; Cable shielding; Coupling circuits; Distributed parameter circuits; Electric variables; Frequency; Integrated circuit interconnections; Printed circuits; Propagation losses; Transmission line theory; Wiring;
Journal_Title :
Proceedings of the IEEE
