Three-dimensional memory module

Author

Takahashi, Nobuaki ; Senba, Naoji ; Shimada, Yuzo ; Morisaki, Ikushi ; Tokuno, Kenichi

Author_Institution

NEC Corp., Kanagawa, Japan

Volume

21

Issue

1

fYear

1998

fDate

2/1/1998 12:00:00 AM

Firstpage

15

Lastpage

19

Abstract

Demand has recently increased for high packaging density and memory capacity of memory modules for electronic equipment. The new three-dimensional memory module satisfies this demand. This module has almost the same size as single memory packages [thin small outline packages (TSOPs): 17.4×9.22×1.2 mm] currently being used, and a package density four times as large. Electrical performance is better than that of TSOP´s because the length of the wires is about half that of the TSOP´s wires. Moreover, the cost of fabrication of this module is low. This paper reports the module´s characteristics and fabrication process. The design concept is that next-generation memory devices will be produced by using current mass-produced memory devices

Keywords

integrated circuit packaging; integrated memory circuits; modules; wires (electric); electronic equipment; fabrication process; memory capacity; next-generation memory devices; package density; packaging density; size; three-dimensional memory module; wires; Bonding; Costs; Electronic equipment; Electronics packaging; Fabrication; National electric code; Packaging machines; Production; Stacking; Wires;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.659501

Filename

659501