Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

Author

Lau, John H. ; Chou, Tai-yu

Author_Institution

Express Packaging Syst. Inc., Palo Alto, CA, USA

Volume

21

Issue

1

fYear

1998

fDate

2/1/1998 12:00:00 AM

Firstpage

35

Lastpage

42

Abstract

An electrically and thermally optimized plastic ball grid array (PBGA) package, called new and useful ball grid array (NuBGA) is presented. NuBGA is a cavity down package with a metal heat spreader covering the entire back-side of the chip. The heat spreader is laminated with a single-core double-sided organic substrate. Super electrical performance is achieved by using the split-wrap-around (SWA) or split-via-connection (SVC) design concepts. All traces on the core substrate are designed into μ-stripline and co-planar stripline structures. In this paper, the focus is on (1) the unique design concepts; (2) the electrical measurement; (3) the electrical analysis; (4) the electrical performance comparison with other standard packages

Keywords

plastic packaging; μ-stripline; NuBGA; PBGA; cavity down package; co-planar stripline; electrical design; metal heat spreader; new and useful ball grid array; plastic ball grid array package; single-core double-sided organic substrate; split-via-connection; split-wrap-around; thermal enhancement; Copper; Costs; Electronic packaging thermal management; Electronics packaging; Nonhomogeneous media; Plastic packaging; Static VAr compensators; Stripline; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.659504

Filename

659504