Title :
Attenuation in silver-filled conductive epoxy interconnects
Author :
Wentworth, Stuart M. ; Dillaman, Brian L. ; Chadwick, Jon R. ; Ellis, Charles D. ; Johnson, R. Wayne
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
fDate :
3/1/1997 12:00:00 AM
Abstract :
The attenuation of microstrip transmission lines fabricated with a new type of multiphase epoxy adhesive, called area bonding conductive (ABC) adhesive, has been measured from 45 MHz to 10 GHz. This ABC adhesive consists of a silver flake fill in a polymer matrix, and allows for both thermal and electrical conductivity in addition to increased strength. The board processing details are discussed along with the screen printing procedure. A technique for extracting the attenuation and sheet resistivity is presented which is based on network analyzer measurements of the S21 scattering parameter. The performance for three different concentrations of silver flake in the conductive epoxy is compared with copper microstrip. There is a significant decrease in attenuation and sheet resistance as the concentration of silver increases, but in all cases the attenuation is a well-behaved function of frequency. Also, it is shown that microstrip transmission lines fabricated using stencil printing perform better at high frequencies than those made from screen printing
Keywords :
S-parameters; adhesion; composite materials; conducting materials; filled polymers; microstrip lines; silver; 45 MHz to 10 GHz; Ag; area bonding conductive adhesive; attenuation; board processing; electrical conductivity; interconnect; microstrip transmission line; multiphase material; network analyzer; polymer matrix; scattering parameters; screen printing; sheet resistivity; silver flakes; silver-filled epoxy; stencil printing; strength; thermal conductivity; Area measurement; Attenuation measurement; Bonding; Conductivity measurement; Frequency; Microstrip; Printing; Silver; Thermal conductivity; Transmission line matrix methods;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
