• DocumentCode
    1334329
  • Title

    A robust metric for measuring within-wafer uniformity

  • Author

    Davis, Joseph C. ; Gyurcsik, Ronald S. ; Lu, Jye-Chyi ; Hughes-Oliver, Jacqueline M.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    19
  • Issue
    4
  • fYear
    1996
  • fDate
    10/1/1996 12:00:00 AM
  • Firstpage
    283
  • Lastpage
    289
  • Abstract
    Within-wafer uniformity is traditionally measured by the signal-to-noise ratio (SNR), defined as the estimated standard-deviation of within-wafer measurements over the mean of those measurements, Unfortunately, in the presence of deterministic variations of the response over the wafer (such as the bull´s eye effect of some processes), the SNR is sensitive to both the location and the number of the measurements taken, A robust metric for describing within-wafer uniformity is developed and compared with the SNR method. The new metric, termed the integration statistic (I) is shown to be robust to both the location and number of measurements taken on the wafer and has lower variance than the SNR metric. The implications of this robust behavior are that fewer measurements can be taken to achieve a given accuracy in the uniformity estimate and that uniformity estimates are consistent with respect to variations in the orientation of the uniformity pattern to the measurement pattern
  • Keywords
    fault location; integrated circuit manufacture; integrated circuit measurement; production testing; statistical analysis; bull´s eye effect; deterministic variations; fault detection; integration statistic; robust measurement; signal-to-noise ratio; uniformity estimate; uniformity pattern; within-wafer uniformity; Condition monitoring; Fault detection; Instruments; Materials processing; Measurement standards; Metrology; Process design; Robustness; Signal to noise ratio; Statistics;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4400
  • Type

    jour

  • DOI
    10.1109/3476.558556
  • Filename
    558556