Title :
A hybrid amplifier as an RF building block
Author :
Eskelinen, P. ; Salpala, A.
Author_Institution :
Res. Labs., Kotka Inst. of Technol., Finland
fDate :
8/1/1996 12:00:00 AM
Abstract :
A hybrid RF amplifier SMD-chip offers the benefit of a really simple bypass circuitry, ease of construction and minimal size. As an example, with the MiniCircuits VNA, a gain of about 15 dB can be achieved through the frequency band of 500 MHz to 3 GHz. Input matching can be near a VSWR of 1.9. At frequencies above 3 GHz however the input might provide a reflection coefficient greater than unity depending on the mechanical solutions of the test setup. Conventional assembly techniques can be used, but hybrid amplifiers are better-suited to more complex SMD boards
Keywords :
hybrid integrated circuits; integrated circuit packaging; microwave amplifiers; radiofrequency amplifiers; surface mount technology; 15 dB; 500 MHz to 3 GHz; MiniCircuits VNA; RF amplifier SMD-chip; RF building block; SMD boards; VSWR; assembly; bypass circuitry; hybrid amplifier; hybrid amplifiers; input matching; Assembly; Capacitors; Connectors; Performance analysis; Prototypes; Radio frequency; Radiofrequency amplifiers; Reactive power; Reflection; System testing;
Journal_Title :
Aerospace and Electronic Systems Magazine, IEEE
