Title :
Equivalent Circuit Model for Metamaterial-Based Electromagnetic Band-Gap Isolator
Author :
Song, Young Jun ; Sarabandi, Kamal
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan at Ann Arbor, Ann Arbor, MI, USA
fDate :
7/4/1905 12:00:00 AM
Abstract :
This letter describes the performance characteristics of single-layer 1-D periodic resonant structures embedded in a metal-backed substrate. Such structures are known to behave as an electromagnetic band-gap (EBG) layer that can suppress the dominant substrate mode. For short distances in thin substrates, it is shown that the dominant TM0odd with a zero cutoff frequency can be approximated by a TEM wave inside and in the vicinity of the thin substrate. The propagation of this TEM wave is then modeled by an equivalent transmission-line model. The effect of the resonant EBG structure on the wave propagation in the equivalent transmission-line model is taken into consideration by modeling the EBG structure in terms of an equivalent LC circuit and establishing the proper electric and magnetic mutual couplings between the LC circuit and the transmission-line model. The performance of the equivalent circuit model is compared to the full-wave simulation of the actual structure, and a very good agreement is shown.
Keywords :
electromagnetic metamaterials; electromagnetic wave propagation; equivalent circuits; transmission line theory; EBG layer; TEM wave propagation; dominant substrate mode suppression; electric mutual couplings; equivalent LC circuit; equivalent circuit model; equivalent transmission-line model; full-wave simulation; magnetic mutual couplings; metal-backed substrate; metamaterial-based electromagnetic band-gap isolator; resonant EBG structure; single-layer 1-D periodic resonant structures; thin substrates; Integrated circuit modeling; Isolators; Magnetic resonance; Metamaterials; Mutual coupling; Periodic structures; Substrates; Electromagnetic band-gap (EBG) materials; electromagnetic shielding; interference suppression; mutual coupling;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2012.2227664