• DocumentCode
    1335112
  • Title

    Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes

  • Author

    Alimenti, F. ; Mezzanotte, P. ; Dionigi, Marco ; Virili, M. ; Roselli, Luca

  • Author_Institution
    Dept. of Electronic and Information Engineering, University of Perugia, Perugia, Italy
  • Volume
    22
  • Issue
    12
  • fYear
    2012
  • Firstpage
    660
  • Lastpage
    662
  • Abstract
    In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz.
  • Keywords
    Fabrication; Microstrip; Microwave circuits; Substrates; Transmission lines; Flexible substrates; green electronics; microwave circuits; paper substrates; transmission lines;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2012.2227141
  • Filename
    6353599
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1335112