Title :
Power interference cancellation for dual-band transcutaneous bio-implant systems
Author :
Shin, Seung Heon ; Kang, Sung-Mo
Author_Institution :
Jack Baskin Sch. of Eng., Univ. of California, Santa Cruz, CA, USA
Abstract :
An integrated circuit structure for a dual-band transcutaneous bio-implant system that can remove the problematic power interference coupled into the weak data telemetry signal is presented. The unwanted effect of coupled power interference is efficiently suppressed through a feedback cancellation that directly annihilates the interference with an optimally tuned fraction of the received power signal by the implanted power receiver.
Keywords :
biomedical electronics; integrated circuits; interference suppression; prosthetics; dual-band transcutaneous bioimplant systems; feedback cancellation; implanted power receiver; integrated circuit; power interference cancellation; weak data telemetry signal;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2012.3517
