• DocumentCode
    1336008
  • Title

    4H-silicon carbide modified-anode gate turn-off thyristor

  • Author

    Shah, P.B.

  • Author_Institution
    US Army Res. Lab., AMSRL-SE-RL, Adelphi, MD, USA
  • Volume
    36
  • Issue
    7
  • fYear
    2000
  • fDate
    3/30/2000 12:00:00 AM
  • Firstpage
    671
  • Lastpage
    672
  • Abstract
    4H-silicon carbide modified-anode gate turn-off thyristor drift-diffusion model simulations of a pn-pn-pn type silicon carbide modified-anode gate turn-off (MA-GTO) thyristor structure indicate that the addition of thin n-p layers below the p-type anode region assists hole injection into the drift region of the thyristor. This allows current crowding to be avoided by increasing the dopant concentration of the n-type gated base layer without the consequence of a drastic increase in on-state voltage drop and holding current
  • Keywords
    doping profiles; semiconductor device models; silicon compounds; thyristors; wide band gap semiconductors; 4H-SiC device; MA-GTO thyristor structure; SiC; current crowding elimination; dopant concentration; drift region; drift-diffusion model simulations; gate turn-off thyristor; holding current; hole injection; modified-anode GTO thyristor; n-type gated base layer; on-state voltage drop; p-type anode region; pn-pn-pn type; thin n-p layers;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20000525
  • Filename
    842232