• DocumentCode
    1336127
  • Title

    Design and Fabrication of Large-Area, Redundant, Stretchable Interconnect Meshes Using Excimer Laser Photoablation and In Situ Masking

  • Author

    Lin, Kevin L. ; Chae, Junghun ; Jain, Kanti

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    33
  • Issue
    3
  • fYear
    2010
  • Firstpage
    592
  • Lastpage
    601
  • Abstract
    Stretchable interconnects play an important role towards the realization of the realm of systems that include large-area sensor skins and wearable electronics. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to nonplanar surfaces for diverse applicability. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser photoablation. The fluences for photoablation of polymers are generally much lower than the threshold fluence for removal or damage of metals; thus, metal thin films that are designed as structural layers in the sensor skin can be used as in situ masks for polymers if the proper fluence is used. Self-aligned single-layer and multilayer interconnects of various designs (rectilinear and “meandering”) have been fabricated, and certain “meandering” interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. Furthermore, redundant interconnect meshes have been modeled and fabricated that increase the viability of the interconnect mesh while stretching up to 30% uniaxially and a prototype redundant interconnect mesh has been fabricated using seamless-scanning large-area fabrication techniques.
  • Keywords
    flexible electronics; interconnections; laser ablation; masks; metallisation; polymers; excimer laser photoablation; in situ masking; large area redundant stretchable interconnect meshes; meandering interconnect design; metal patterns; metal thin films; multilayer interconnects; polymer substrates; rectilinear interconnect design; seamless scanning large area fabrication technique; self aligned single layer interconnects; Excimer laser photoablation; flexible electronics; large-area sensor skins; micro-electro-mechanical system (MEMS); redundant interconnects; sensor arrays; stretchable interconnects;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2032158
  • Filename
    5337974