• DocumentCode
    1336234
  • Title

    Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

  • Author

    Yin, Huiming M.

  • Author_Institution
    Dept. of Civil Eng. & Eng. Mech., Columbia Univ., New York, NY, USA
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    353
  • Lastpage
    355
  • Abstract
    An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir´s result. However, a minor inconsistence in Suhir´s derivation is still found. The applicability and modification of Suhir´s model are discussed.
  • Keywords
    approximation theory; electronics packaging; integrated circuits; Basaran; Suhir; Wen; approximation; interfacial compliance influence; longitudinal interfacial compliance; multilayered microelectronic packaging; thermomechanical stresses; Capacitive sensors; Civil engineering; Electronics packaging; Equations; Microelectronics; Strips; Thermal stresses; Thermomechanical processes; Transistors; Elastic analysis; electronic packaging; interfacial compliance; thin film;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2033571
  • Filename
    5337990