DocumentCode
1336234
Title
Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Author
Yin, Huiming M.
Author_Institution
Dept. of Civil Eng. & Eng. Mech., Columbia Univ., New York, NY, USA
Volume
33
Issue
2
fYear
2010
fDate
5/1/2010 12:00:00 AM
Firstpage
353
Lastpage
355
Abstract
An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir´s result. However, a minor inconsistence in Suhir´s derivation is still found. The applicability and modification of Suhir´s model are discussed.
Keywords
approximation theory; electronics packaging; integrated circuits; Basaran; Suhir; Wen; approximation; interfacial compliance influence; longitudinal interfacial compliance; multilayered microelectronic packaging; thermomechanical stresses; Capacitive sensors; Civil engineering; Electronics packaging; Equations; Microelectronics; Strips; Thermal stresses; Thermomechanical processes; Transistors; Elastic analysis; electronic packaging; interfacial compliance; thin film;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2009.2033571
Filename
5337990
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