DocumentCode
1337334
Title
Iddq testing for CMOS VLSI
Author
Rajsuman, Rochit
Author_Institution
Advantest America R&D Center, Santa Clara, CA, USA
Volume
88
Issue
4
fYear
2000
fDate
4/1/2000 12:00:00 AM
Firstpage
544
Lastpage
568
Abstract
It is little more than 15-years since the idea of Iddq testing was first proposed. Many semiconductor companies now consider Iddq testing as an integral part of the overall testing for all IC´s. This paper describes the present status of Iddq testing along with the essential items and necessary data related to Iddq testing. As part of the introduction, a historical background and discussion is given on why this test method has drawn attention. A section on physical defects with in-depth discussion and examples is used to illustrate why a test method outside the voltage environment is required. Data with additional information from case studies is used to explain the effectiveness of Iddq testing. In Section IV, design issues, design styles, Iddq test vector generation and simulation methods are discussed. The concern of whether Iddq testing will remain useful in deep submicron technologies is addressed (Section V). The use of Iddq testing for reliability screening is described (Section VI). The current measurement methods for Iddq testing are given (Section VII) followed by comments on the economics of Iddq testing (Section VIII). In Section IX pointers to some recent research are given and finally, concluding remarks are given in Section X.
Keywords
CMOS integrated circuits; VLSI; fault diagnosis; integrated circuit economics; integrated circuit reliability; integrated circuit testing; CMOS; IC testing; Iddq testing; VLSI; deep submicron technologies; economics; physical defects; reliability screening; test vector generation; voltage environment; Circuit faults; Circuit testing; Current measurement; Electronic equipment testing; Integrated circuit technology; Integrated circuit testing; Power generation economics; Semiconductor device testing; System testing; Very large scale integration;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.843000
Filename
843000
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