• DocumentCode
    1337334
  • Title

    Iddq testing for CMOS VLSI

  • Author

    Rajsuman, Rochit

  • Author_Institution
    Advantest America R&D Center, Santa Clara, CA, USA
  • Volume
    88
  • Issue
    4
  • fYear
    2000
  • fDate
    4/1/2000 12:00:00 AM
  • Firstpage
    544
  • Lastpage
    568
  • Abstract
    It is little more than 15-years since the idea of Iddq testing was first proposed. Many semiconductor companies now consider Iddq testing as an integral part of the overall testing for all IC´s. This paper describes the present status of Iddq testing along with the essential items and necessary data related to Iddq testing. As part of the introduction, a historical background and discussion is given on why this test method has drawn attention. A section on physical defects with in-depth discussion and examples is used to illustrate why a test method outside the voltage environment is required. Data with additional information from case studies is used to explain the effectiveness of Iddq testing. In Section IV, design issues, design styles, Iddq test vector generation and simulation methods are discussed. The concern of whether Iddq testing will remain useful in deep submicron technologies is addressed (Section V). The use of Iddq testing for reliability screening is described (Section VI). The current measurement methods for Iddq testing are given (Section VII) followed by comments on the economics of Iddq testing (Section VIII). In Section IX pointers to some recent research are given and finally, concluding remarks are given in Section X.
  • Keywords
    CMOS integrated circuits; VLSI; fault diagnosis; integrated circuit economics; integrated circuit reliability; integrated circuit testing; CMOS; IC testing; Iddq testing; VLSI; deep submicron technologies; economics; physical defects; reliability screening; test vector generation; voltage environment; Circuit faults; Circuit testing; Current measurement; Electronic equipment testing; Integrated circuit technology; Integrated circuit testing; Power generation economics; Semiconductor device testing; System testing; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/5.843000
  • Filename
    843000