DocumentCode :
13376
Title :
Influence on Cooling Performance of Jet Impingement Heat Sink Structures
Author :
Nakahama, T. ; Tai, Heng-Ming
Author_Institution :
Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu, Japan
Volume :
3
Issue :
5
fYear :
2013
fDate :
May-13
Firstpage :
818
Lastpage :
825
Abstract :
We studied a jet impingement heat sink for cooling modular power semiconductor devices. The purpose of the study was to investigate the influences on cooling performance of simplified structures of the heat sinks that suppresses the jet velocity to avoid pitting corrosion or erosion of the impingement wall. The influence on the cooling performance of partition plates used to prevent mutual interference between jets from circular nozzles was verified. We confirmed the influence on the cooling performance of the wall shape of the header and the influence of the distance from the nozzle to the wall (jet height) in the case of small ratio of the jet height to the nozzle diameter. We verified the influence on the cooling performance of the relation between the directions of the array of multiple jets and the direction of the exhaust flow. Flow visualization was performed using a mock-up model of a jet impingement heat sink. From the visualization, we found the reason on the influence of the relation between those directions. As a result, we found that the structure of the heat sink was able to be simplified maintaining the cooling performance of the conventional heat sink.
Keywords :
cooling; corrosion protection; flow visualisation; heat sinks; interference suppression; jets; nozzles; power semiconductor devices; circular nozzle; cooling performance; exhaust flow direction; flow visualization; impingement wall erosion; jet impingement heat sink structure; jet velocity suppression; mock-up model; modular power semiconductor device; multiple jet array; mutual interference prevention; pitting corrosion; Chip; cooling; device; experiment; flow visualization; heat sink; jet impingement; power semiconductor module;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2252712
Filename :
6495709
Link To Document :
بازگشت