Title :
Modeling, measurement, and simulation of simultaneous switching noise
Author :
McCredie, Bradley D. ; Becker, Wiren D.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
fDate :
8/1/1996 12:00:00 AM
Abstract :
The computer package designer depends on modeling power supply noises to ensure that system designs will function properly. Power supply noises can have a tremendous effect on system operation and performance. The circuit simulation of a system power distribution is very challenging since it requires accurate models of active devices, passive components, transmission lines, and a very large power distribution network. This paper presents the development of a high-frequency power distribution model for the simulation of simultaneous switching noise of a complementary metal-oxide-semiconductor (CMOS) chip on a multilayered ceramic substrate. Measurements are performed on a CMOS chip with simultaneously switching off-chip drivers (OCD´s). The modeling approach is validated by the excellent agreement between the measurement waveforms and simulation results
Keywords :
CMOS integrated circuits; circuit analysis computing; driver circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; CMOS chip; circuit simulation; computer package design; high-frequency power distribution model; multilayered ceramic substrate; off-chip driver; power supply noise; simultaneous switching noise; Circuit noise; Circuit simulation; Computational modeling; Packaging; Power distribution; Power supplies; Power system modeling; Power transmission lines; Semiconductor device measurement; Semiconductor device modeling;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on