Title :
Characterization of a small peripheral array package
Author :
Hao, Jie ; Richter, Andre ; Laskar, Joy ; Swaminathan, Madhavan ; Mosley, J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
8/1/1996 12:00:00 AM
Abstract :
This paper provides details on a very small peripheral array (VSPA) cavity package with high I/O´s that is surface mountable on a printed circuit board (PCB). The package consists of 320 leads and measures 27 mm on a side. This paper discusses the package attributes, comparison to equivalent packages, and characterization of the package parasitics up to 3.5 GHz
Keywords :
equivalent circuits; integrated circuit packaging; surface mount technology; 27 mm; 3.5 GHz; PCB mountable package; SMD; SMT; VSPA cavity package; characterization; package parasitics; printed circuit board; surface mountable package; very small peripheral array package; Bonding; Costs; Electronics packaging; Lead; Pins; Plastic packaging; Printed circuits; Space heating; Thermal conductivity; Wire;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
