• DocumentCode
    1337691
  • Title

    A surface mount single-mode laser module using passive alignment

  • Author

    Kurata, Kazuhiko ; Yamauchi, Kenji ; Kawatani, Atsuhiro ; Tanaka, Hideki ; Honmou, Hiroshi ; Ishikawa, Shigeta

  • Author_Institution
    Opt. Devices Dev. Dept., NEC Corp., Kanagawa, Japan
  • Volume
    19
  • Issue
    3
  • fYear
    1996
  • fDate
    8/1/1996 12:00:00 AM
  • Firstpage
    524
  • Lastpage
    531
  • Abstract
    A novel single-mode laser module has been developed using a surface mounting technique. A simple receptacle structure for the module output port is also designed. This module offers high coupling efficiency and optical coupling using the passive alignment technique. A module size of 7.6 mm×12 mm×3 mm is achieved, which is very friendly for the automatic assembly line as well as the module mounting process on circuit boards. A laser diode (LD) is passively positioned by utilizing a pair of alignment marks, each of which located on the LD and Si substrate, a single-mode fiber with a microhemispherical lens on the fiber facet is self-aligned on a Si-V groove. The LD to single-mode fiber coupling loss and standard deviation are found to be 5 dB and 1.5 db, respectively. The simple receptacle structure enables one to use this module in the same way as conventional surface mount electrical components. The module assembly process is simplified by successively mounting subassembly parts
  • Keywords
    laser modes; microassembling; optical communication equipment; optical couplers; optical fibre communication; semiconductor device packaging; semiconductor lasers; surface mount technology; 5 dB; Si; Si V-groove; Si substrate; fiber coupling loss; fiber facet; high coupling efficiency; laser diode; microhemispherical lens; module assembly process; optical coupling; passive alignment; receptacle structure; self-alignment; single-mode fiber; single-mode laser module; surface mount module; Assembly; Costs; Coupling circuits; National electric code; Optical coupling; Optical fibers; Packaging; Printed circuits; Substrates; Surface emitting lasers;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.533891
  • Filename
    533891