Title :
A surface mount single-mode laser module using passive alignment
Author :
Kurata, Kazuhiko ; Yamauchi, Kenji ; Kawatani, Atsuhiro ; Tanaka, Hideki ; Honmou, Hiroshi ; Ishikawa, Shigeta
Author_Institution :
Opt. Devices Dev. Dept., NEC Corp., Kanagawa, Japan
fDate :
8/1/1996 12:00:00 AM
Abstract :
A novel single-mode laser module has been developed using a surface mounting technique. A simple receptacle structure for the module output port is also designed. This module offers high coupling efficiency and optical coupling using the passive alignment technique. A module size of 7.6 mm×12 mm×3 mm is achieved, which is very friendly for the automatic assembly line as well as the module mounting process on circuit boards. A laser diode (LD) is passively positioned by utilizing a pair of alignment marks, each of which located on the LD and Si substrate, a single-mode fiber with a microhemispherical lens on the fiber facet is self-aligned on a Si-V groove. The LD to single-mode fiber coupling loss and standard deviation are found to be 5 dB and 1.5 db, respectively. The simple receptacle structure enables one to use this module in the same way as conventional surface mount electrical components. The module assembly process is simplified by successively mounting subassembly parts
Keywords :
laser modes; microassembling; optical communication equipment; optical couplers; optical fibre communication; semiconductor device packaging; semiconductor lasers; surface mount technology; 5 dB; Si; Si V-groove; Si substrate; fiber coupling loss; fiber facet; high coupling efficiency; laser diode; microhemispherical lens; module assembly process; optical coupling; passive alignment; receptacle structure; self-alignment; single-mode fiber; single-mode laser module; surface mount module; Assembly; Costs; Coupling circuits; National electric code; Optical coupling; Optical fibers; Packaging; Printed circuits; Substrates; Surface emitting lasers;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on