A low-cost high-performance optical interconnect

Author

Schwartz, Daniel B. ; Chun, Christopher K Y ; Foley, Barbara M. ; Hartman, Davis H. ; Lebby, Michael ; Lee, H.C. ; Shieh, Chan Long ; Kuo, Shun Meen ; Shook, Stephen G. ; Webb, Brian

Author_Institution

Photonics Technol. Center, Motorola Inc., Tempe, AZ, USA

Volume

19

Issue

3

fYear

1996

fDate

8/1/1996 12:00:00 AM

Firstpage

532

Lastpage

539

Abstract

The Optobus link is a ten channel parallel bidirectional data link based on multimode fiber ribbons. The guiding principal of the Optobus design was to produce an optical interconnect capable of competing with copper on price, not just performance. Recognizing that packaging dominates the cost of optical interconnects, the design focused on minimizing the complexity of the optical subassembly. A key component of this strategy is the use of AlGaAs/GaAs vertical cavity surface emitting lasers (VCSELs). Another is designing the silicon receiver and transmitter arrays around the module level packaging parasitics. The resulting parallel transceiver modules achieve a minimum throughput of 1.5 Gb/s in each direction with a power dissipation of 1.6 W

Keywords

optical fibre communication; optical interconnections; packaging; surface emitting lasers; transceivers; 1.5 Gbit/s; 1.6 W; AlGaAs-GaAs; AlGaAs/GaAs VCSEL; Optobus; Si; cost; design; multichannel parallel bidirectional data link; multimode fiber ribbon; optical interconnect; optical subassembly; packaging parasitics; parallel transceiver module; silicon receiver array; silicon transmitter array; Copper; Costs; Gallium arsenide; Optical design; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Stimulated emission; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.533892

Filename

533892