• DocumentCode
    1337712
  • Title

    622 Mb/s/channel parallel digital optical receiver array module using hybrid packaging

  • Author

    Siala, Sabeur ; Ramakrishnan, Vinodkumar ; Govindarajan, M. ; Dekovic, Y. ; Kinter, R. ; Padilla, J. ; Levi, Anthony F J ; Nottenburg, Richard N.

  • Author_Institution
    SDL Inc., San Jose, CA, USA
  • Volume
    19
  • Issue
    3
  • fYear
    1996
  • fDate
    8/1/1996 12:00:00 AM
  • Firstpage
    548
  • Lastpage
    553
  • Abstract
    Given the high data rates (>500 Mb/s) achievable in optical links using current device technologies, low cost packaging of transmitters and receivers plays a key role in rendering them viable for short-haul data communication networks. The authors report a 12 channel, fully digital, hybrid receiver module for a synchronous parallel optical datalink operating at 622 Mb/s/channel. The use of a multichip module (MCM) and the passive alignment of the MT-connectorized multimode ribbon fiber to the photodetector array resulted in a simple low cost packaging solution
  • Keywords
    data communication equipment; digital communication; multichip modules; optical fibre networks; optical links; optical receivers; packaging; 622 Mbit/s; MT-connectorized multimode ribbon fiber; data rates; hybrid packaging; multichip module; optical links; parallel digital optical receiver array module; passive alignment; photodetector array; short-haul data communication networks; synchronous parallel optical datalink; Clocks; Costs; Data communication; Distributed computing; Optical arrays; Optical fiber communication; Optical receivers; Optical transmitters; Packaging; Photodetectors;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.533894
  • Filename
    533894