Title :
622 Mb/s/channel parallel digital optical receiver array module using hybrid packaging
Author :
Siala, Sabeur ; Ramakrishnan, Vinodkumar ; Govindarajan, M. ; Dekovic, Y. ; Kinter, R. ; Padilla, J. ; Levi, Anthony F J ; Nottenburg, Richard N.
Author_Institution :
SDL Inc., San Jose, CA, USA
fDate :
8/1/1996 12:00:00 AM
Abstract :
Given the high data rates (>500 Mb/s) achievable in optical links using current device technologies, low cost packaging of transmitters and receivers plays a key role in rendering them viable for short-haul data communication networks. The authors report a 12 channel, fully digital, hybrid receiver module for a synchronous parallel optical datalink operating at 622 Mb/s/channel. The use of a multichip module (MCM) and the passive alignment of the MT-connectorized multimode ribbon fiber to the photodetector array resulted in a simple low cost packaging solution
Keywords :
data communication equipment; digital communication; multichip modules; optical fibre networks; optical links; optical receivers; packaging; 622 Mbit/s; MT-connectorized multimode ribbon fiber; data rates; hybrid packaging; multichip module; optical links; parallel digital optical receiver array module; passive alignment; photodetector array; short-haul data communication networks; synchronous parallel optical datalink; Clocks; Costs; Data communication; Distributed computing; Optical arrays; Optical fiber communication; Optical receivers; Optical transmitters; Packaging; Photodetectors;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on