• DocumentCode
    1337720
  • Title

    Optical performance of low-cost self-aligned MCM-D based optical data links

  • Author

    Dautartas, Mino F. ; Benzoni, Albert M. ; Broutin, Scott L. ; Coucoulas, Alexander ; Moser, David T. ; Wong, Y.-H. ; Yiu-Man Wong

  • Author_Institution
    Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
  • Volume
    19
  • Issue
    3
  • fYear
    1996
  • fDate
    8/1/1996 12:00:00 AM
  • Firstpage
    554
  • Lastpage
    561
  • Abstract
    We discuss the details of the design and performance of the optics proposed for a MCM-D based low-cost multimode optical data link. The optical system is completely self-aligned, taking advantage of flip-chip bonding, solder-bump self-alignment, mechanical self-alignment using silicon micromachining, and precision plastic components. Preliminary results demonstrate that the integral-lens design of the opto electronic device significantly effects the coupling efficiency and the requisite tolerances of the components that comprise the coupling optics. We show that coupling efficiencies of 70% or better are readily achievable with piece parts made using standard practices. These coupling efficiencies compare favorably with those in actively-aligned optical subassemblies used in current optical data link products
  • Keywords
    data communication; data communication equipment; flip-chip devices; multichip modules; optical fibre couplers; optical links; coupling efficiencies; coupling efficiency; coupling optics; flip-chip bonding; integral-lens design; mechanical self-alignment; micromachining; multimode optical data link; precision plastic components; requisite tolerances; self-aligned MCM-D based optical data links; solder-bump self-alignment; Consumer electronics; Costs; Lenses; Optical coupling; Optical design; Optical devices; Optical interconnections; Optical receivers; Optical transmitters; Plastics;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.533895
  • Filename
    533895