Title :
A packaging technique for an optical 90°-hybrid balanced receiver using a planar lightwave circuit
Author :
Tsunetsugu, Hideki ; Hosoya, Masakaze ; Norimatsu, Seiji ; Takachio, Noboru ; Inoue, Yasuyuki ; Hata, Susumu
Author_Institution :
NTT Interdisciplinary Res. Labs., Tokyo, Japan
fDate :
8/1/1996 12:00:00 AM
Abstract :
A new technique has been developed for packaging an optical 90°-hybrid balanced receiver using a planar lightwave circuit (PLC) for the application to an optical homodyne detection system. This receiver consists of a silica-based PLC as an optical coupler, two polarization beam splitters (PBSs), two GRIN rod lenses to achieve perfect optical interconnections, two photoreceivers that each have a preamplifier, and twin p-i-n photodiodes (PIN-PDs). The photoreceivers are fabricated using microsolder bump bonding to eliminate parasitic elements in the interconnections between the preamplifiers and the PIN-PDs. An impedance-matched film carrier technique is used to achieve impedance-matched interconnections between the preamplifiers and the ceramic packages. Experiments showed that a receiver fabricated using this packaging technique has excellent performance: a broad-band frequency response of 14 GHz and, consequently, 10-Gb/s binary phase shift keying (BPSK) homodyne detection
Keywords :
gradient index optics; optical fibre couplers; optical interconnections; optical planar waveguides; optical receivers; p-i-n photodiodes; packaging; phase shift keying; 10 Gbit/s; 14 GHz; GRIN rod lenses; binary phase shift keying; broad-band frequency response; ceramic packages; impedance-matched film carrier technique; impedance-matched interconnections; microsolder bump bonding; optical 90°-hybrid balanced receiver; optical coupler; optical homodyne detection system; p-i-n photodiodes; packaging technique; perfect optical interconnections; photoreceivers; planar lightwave circuit; polarization beam splitters; Binary phase shift keying; Impedance; Integrated circuit interconnections; Optical detectors; Optical films; Optical interconnections; Optical receivers; Packaging; Preamplifiers; Programmable control;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on