• DocumentCode
    1337848
  • Title

    Enhanced Current Drivability of CVD Graphene Interconnect in Oxygen-Deficient Environment

  • Author

    Kang, Chang Goo ; Lee, Sang Kyung ; Lee, Young Gon ; Hwang, Hyeon Jun ; Cho, Chunhum ; Lim, Sung Kwan ; Heo, Jinseong ; Chung, Hyun-Jong ; Yang, Heejun ; Seo, Sunae ; Lee, Byoung Hun

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
  • Volume
    32
  • Issue
    11
  • fYear
    2011
  • Firstpage
    1591
  • Lastpage
    1593
  • Abstract
    Graphene has been considered as a candidate for interconnect metal due to its high carrier mobility and current drivability. In this letter, the breakdown mechanism of single-layer chemical-vapor-deposited (CVD) graphene and triple-layer CVD graphene has been investigated at three different conditions (air exposed, vacuum, and dielectric capped) to identify a failure mechanism. In vacuum, both single- and triple-layer graphenes demonstrated a breakdown current density as high as ~108 A/cm2, which is similar to that of exfoliated graphene. On the other hand, the breakdown current of graphene exposed to air was degraded by one order of magnitude from that of graphene tested in vacuum. Thus, oxidation initiated at the defect sites of CVD graphene was suggested as a major failure mechanism in air, while Joule heating was more dominant with dielectric capping and in vacuum.
  • Keywords
    chemical vapour deposition; current density; electric breakdown; graphene; integrated circuit interconnections; oxidation; C; CVD graphene interconnect; Joule heating; breakdown current density; breakdown mechanism; carrier mobility; chemical vapor deposition; current drivability; dielectric capping; failure mechanism; oxygen-deficient environment; single-layer graphene; triple-layer graphene; Aluminum oxide; Conductivity; Copper; Current density; Heating; Vacuum breakdown; Breakdown; current density; failure mechanism; graphene; interconnect;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2166240
  • Filename
    6032709