Title :
Exponential Impedance-Transformer Stalks Used for Magnetically Insulated Induction Voltage Adders
Author :
Yixiang Hu ; Fengju Sun ; Jiangtao Zeng ; Ai´ci Qiu ; Hao Wei ; Jiahui Yin ; Peitian Cong
Author_Institution :
State Key Lab. of Intense Pulsed Radiat. Simulation & Effect, Northwest Inst. of Nucl. Technol., Xi´an, China
Abstract :
An exponential impedance-transformer stalk was proposed for magnetically insulated induction voltage adders (MIVAs). Based on a 10-cell TLCODE model, performances of stalks with linear, stepped, and exponential profiles were quantified and analyzed as a function of m (the ratio of the adder output impedance to the one that is driver matched, m ≥ 1). Simulation results show that when m ≥ 1.5, stalks with the exponential profile result to the highest adder output voltages with a reverse voltage ~7.5% of the dominative voltage, and the η (the ratio of the subtraction between adder peak voltages with exponential and stepped profiles to the one with stepped profile) increases as the m goes up (when m = 5, η is as much as 8%). Simulation results also indicate that with exponential impedance profile, the highest feeding voltage of the 10 cells is ~2 MV when 1 ≤ m ≤ 10, and it always occurs at one of the last five cells. Moreover, it is found that with the exponential profile, the reverse coefficient β (the maximum ratio of the reverse peak voltages to the nominal) is ~9.5%.
Keywords :
impedance convertors; pulsed power supplies; 10-cell TLCODE model; MIVA; adder output impedance; adder output voltages; adder peak voltages; exponential impedance profile; exponential impedance-transformer stalk; exponential profiles; feeding voltage; linear profiles; magnetically insulated induction voltage adders; reverse coefficient; stepped profiles; voltage 2 MV; Adders; Analytical models; Impedance; Integrated circuit modeling; Radiography; Simulation; Sun; Impedance transformer; induction voltage adder; reverse voltage; voltage addition efficiency; waveform distortion; waveform distortion.;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2014.2362684