DocumentCode
1338049
Title
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
Author
De Paulis, Francesco ; Raimondo, Leo ; Orlandi, Antonio
Author_Institution
Dept. of Electr. Eng., Univ. of L´´Aquila, L´´Aquila, Italy
Volume
33
Issue
3
fYear
2010
Firstpage
617
Lastpage
622
Abstract
This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.
Keywords
photonic band gap; printed circuits; thermal analysis; 3D simulations; IR-DROP analysis; PCB; high-frequency electromagnetic property; planar electromagnetic bandgap structures; power integrity; printed circuit board; temperature variation; thermal analysis; thermal assessment; Electromagnetic bandagap; IR-DROP; power integrity (PI); thermal analysis;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2009.2033572
Filename
5339099
Link To Document