DocumentCode :
1338063
Title :
Fatigue life estimation of surface mount solder joints
Author :
Xie, D.J. ; Chan, Yan C. ; Lai, J.K.L. ; Hui, I.K.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Volume :
19
Issue :
3
fYear :
1996
fDate :
8/1/1996 12:00:00 AM
Firstpage :
669
Lastpage :
678
Abstract :
A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Mechanical cycling and thermal shock testing can be conducted directly on the specimen after assembly. In this manner, the specimen represents practical SMT solder joints in electronic products as far as possible. It is shown that the joint strain and stiffness of chip modules are good evaluation indices to reveal the fatigue status of solder joints. It is further proposed that the criterion of 50% load drop should be used for defining the fatigue life of solder joints. Finally, it is recommended that the total displacement Δδ2p be used to measure the strain-fatigue life relation for both leaded and leadless joints
Keywords :
circuit reliability; fatigue; printed circuits; soldering; stress-strain relations; surface mount technology; thermal shock; QFP-solder-PCB assembly; SMT solder joints; fabrication; fatigue life estimation; joint strain; mechanical cycling; printed circuit board; quad flat pack; stiffness; stress-strain properties; surface mount solder joints; surface mount technology; thermal shock testing; Assembly; Electronics packaging; Fabrication; Fatigue; Lead; Life estimation; Printed circuits; Soldering; Stress measurement; Surface-mount technology;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.533910
Filename :
533910
Link To Document :
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