• DocumentCode
    1338099
  • Title

    Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)

  • Author

    Choi, Jinwoo ; Govind, Vinu ; Swaminathan, Madhavan ; Bharath, Krishna

  • Author_Institution
    IBM Syst. & Technol. Group, IBM Corp., Austin, TX, USA
  • Volume
    33
  • Issue
    1
  • fYear
    2010
  • Firstpage
    2
  • Lastpage
    12
  • Abstract
    This paper presents efficient noise isolation and suppression method in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN). Currently, split planes are used for isolation in mixed-signal systems for isolating sensitive RF/analog circuits from noisy digital circuits. However, split planes show good isolation only at low frequencies due to electromagnetic coupling through the gap. The AI-EBG structure-based PDN presented in this paper provides excellent isolation (-80 dB ~ -100 dB) in the frequency range of interest by suppressing almost all possible electromagnetic modes. The AI-EBG structure has been integrated into a mixed-signal test vehicle to demonstrate the isolation level achievable. The ability of the AI-EBG structure to suppress switching noise has been quantified in this paper. The AI-EBG structure provided greater than 100 dB of isolation in passive S-parameter measurement and suppressed in-band noise down to -88 dBm of isolation in a functional test.
  • Keywords
    distribution networks; interference suppression; alternating impedance electromagnetic bandgap; electromagnetic coupling; mixed-signal systems; mixed-signal test vehicle; noise isolation; noisy digital circuits; power distribution network; sensitive RF/analog circuits; split planes; switching noise suppression; Alternating impedance electromagnetic bandgap (AI-EBG) structure; isolation; mixed-signal system; noise suppression; power distribution network (PDN); split planes; transmission matrix method and dispersion diagram;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2033705
  • Filename
    5339105