Title :
Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails
Author :
Rajo-Iglesias, Eva ; Zaman, Ashraf Uz ; Kildal, Per-Simon
Author_Institution :
Signal Theor. & Commun. Dept., Univ. Carlos III of Madrid, Leganes, Spain
Abstract :
The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits.
Keywords :
electronics packaging; microstrip circuits; parallel plate waveguides; bed of nails; gap waveguide; parallel plate cavity mode suppression; parallel plate waveguide; periodically located pins; shielded microstrip circuit packages; textured metal lid; Gap waveguide; microstrip circuit; mode suppression; packaging;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2009.2035960
