Title :
A Novel VSI- and CSI-Fed Dual Stator Induction Motor Drive Topology for Medium-Voltage Drive Applications
Author :
Hatua, Kamalesh ; Ranganathan, V.T.
Author_Institution :
Indian Inst. of Sci., Bangalore, India
Abstract :
A new configuration is proposed for high-power induction motor drives. The induction machine is provided with two three-phase stator windings with their axes in line. One winding is designed for higher voltage and is meant to handle the main (active) power. The second winding is designed for lower voltage and is meant to carry the excitation (reactive) power. The excitation winding is powered by an insulated-gate-bipolar-transistor-based voltage source inverter with an output filter. The power winding is fed by a load-commutated current source inverter. The commutation of thyristors in the load-commutated inverter (LCI) is achieved by injecting the required leading reactive power from the excitation inverter. The MMF harmonics due to the LCI current are also cancelled out by injecting a suitable compensating component from the excitation inverter, so that the electromagnetic torque of the machine is smooth. Results from a prototype drive are presented to demonstrate the concept.
Keywords :
harmonics suppression; induction motor drives; insulated gate bipolar transistors; invertors; power bipolar transistors; stators; CSI-fed dual-stator induction motor drive topology; LCI current; MMF harmonics; VSI-fed dual-stator induction motor drive topology; active power; electromagnetic torque; excitation inverter; excitation winding; high-power induction motor drives; insulated gate bipolar transistor; load-commutated current source inverter; medium-voltage drive applications; reactive power; three-phase stator windings; thyristor commutation; Harmonic analysis; Power harmonic filters; Rotors; Synchronous motors; Thyristors; Torque; Windings; Active reactive induction machine (ARIM); load-commutated inverter (LCI); medium-voltage drive; synchronous machine;
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2010.2081958