Title :
Hysteresis Modulation of Multilevel Inverters
Author :
Shukla, Anshuman ; Ghosh, Arindam ; Joshi, Avinash
Author_Institution :
Power Technol., ABB Corp. Res., Vasteras, Sweden
fDate :
5/1/2011 12:00:00 AM
Abstract :
The hysteresis modulation for power electronic converters is attractive in many different applications because of its unmatched dynamic response and wide command-tracking bandwidth. Its application and benefits for two-level converters are well understood, but the extension of this strategy to multilevel converters is still under development. This paper summarizes and reviews the various hysteresis modulation approaches available in the literature for multilevel converters. The pros and cons of various techniques are described and compared for tracking the reference signal in order to attain an adequate switching optimization, excellent dynamic responses and high accuracy in steady-state operation. By using the recently developed multilevel hysteresis modulation approaches, the advantages of using several accessible dc potentials in a multilevel inverter have been fully exploited. All of these hysteresis modulation approaches are tested for tracking a current reference when applied to a five-level inverter. The relevant simulation and experimental results are also presented. This study will provide a useful framework and point of reference for the future development of hysteresis modulation for multilevel converters.
Keywords :
dynamic response; invertors; power convertors; command tracking bandwidth; current tracking; dc potentials; multilevel converter; multilevel hysteresis modulation; multilevel inverter; power electronic converter; signal tracking; steady-state operation; switching optimization; two-level converter; unmatched dynamic response; Converters; Hysteresis; Insulated gate bipolar transistors; Inverters; Modulation; Switches; Voltage control; Hysteresis modulation; multiband (MB); multilevel converter; multioffset band (MOB); time-based (TB);
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2010.2082001