DocumentCode :
1340634
Title :
A 2-Gb/s Throughput CMOS Transceiver Chipset With In-Package Antenna for 60-GHz Short-Range Wireless Communication
Author :
Mitomo, Toshiya ; Tsutsumi, Yukako ; Hoshino, Hiroaki ; Hosoya, Masahiro ; Wang, Tong ; Tsubouchi, Yuta ; Tachibana, Ryoichi ; Sai, Akihide ; Kobayashi, Yuka ; Kurose, Daisuke ; Ito, Tomohiko ; Ban, Koichiro ; Tandai, Tomoya ; Tomizawa, Takeshi
Author_Institution :
Corp. R&D Center, Wireless Syst. Lab., Toshiba Corp., Kawasaki, Japan
Volume :
47
Issue :
12
fYear :
2012
Firstpage :
3160
Lastpage :
3171
Abstract :
This paper presents a fully integrated CMOS 60-GHz transceiver chipset for short-range and high-speed wireless communication. The target application of the short-range communication is less than 5-cm communication distance and more than 2-Gb/s throughput for file transfer. In order to achieve file transfer, physical (PHY) layers with error packet correction and media access control (MAC) layer with frame-exchanging function are implemented. The MAC is designed to have a high-efficiency feature due to short interval DATA/Acknowledgement (ACK) frame exchange. It is realized by fast transmitter (TX)/receiver (RX) switching. A bonding wire-based in-package antenna is adopted using a standard BGA package without any off-chip 60-GHz components. The proposed chipset is composed of two chips, an RF chip with in-package antenna, and a baseband chip including PHY and MAC layer. The fabricated chipset achieves 2.62-Gb/s PHY data rate, 2.07-Gb/s MAC throughput, and energy consumption of 651 pJ/bit in 3-cm distance.
Keywords :
CMOS integrated circuits; access protocols; antennas; ball grid arrays; lead bonding; radiocommunication; transceivers; BGA package; MAC layer; PHY layer; RF chip; acknowledgement frame exchange; baseband chip; bit rate 2.07 Gbit/s; bit rate 2.62 Gbit/s; bonding wire-based in-package antenna; error packet correction; frame-exchanging function; frequency 60 GHz; high-speed wireless communication; integrated CMOS transceiver chipset; media access control layer; physical layer; receiver switching; short-range wireless communication; throughput CMOS transceiver chipset; transmitter switching; Integrated circuits; Phase locked loops; Radio frequency; Switches; Switching circuits; Throughput; 60 GHz; CMOS integrated circuits; TX/RX switch; millimeter-wave circuits; transceivers;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2012.2216694
Filename :
6363487
Link To Document :
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