• DocumentCode
    1341017
  • Title

    Micromachined Terahertz Rectangular Waveguide Bandpass Filter on Silicon-Substrate

  • Author

    Hu, Jiankun ; Xie, Shengli ; Zhang, Ye

  • Author_Institution
    School of Electronic Engineering (EE), University of Electronic Science and Technology of China, Chengdu, China
  • Volume
    22
  • Issue
    12
  • fYear
    2012
  • Firstpage
    636
  • Lastpage
    638
  • Abstract
    A micromachined 385 GHz rectangular waveguide cavity bandpass filter is presented. The proposed filter is fabricated using deep reactive ion etching on silicon substrate, with sputtered gold inner surface metallization. The vector network analyzer measured results show the lowest insertion loss is about 2.7 dB with a 15 GHz bandwidth. Effects of micro-electro-mechanical systems process on the filter´s performance are discussed in detail.
  • Keywords
    Band pass filters; Cavity resonators; Loss measurement; Micromechanical devices; Rectangular waveguides; Bandpass filter (BPF); micro-electro-mechanical systems (MEMS); rectangular waveguide; terahertz (THz);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2012.2228179
  • Filename
    6365277
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1341017