Role of rapid photothermal processing in process integration

Author

Singh, R. ; Nimmagadda, Srikanth V. ; Parihar, Vijay ; Chen, Yuanning ; Poole, Kelvin F.

Author_Institution

Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA

Volume

45

Issue

3

fYear

1998

fDate

3/1/1998 12:00:00 AM

Firstpage

643

Lastpage

654

Abstract

The smaller dimension devices and larger scales of integration are demanding constant reduction of the macroscopic and microscopic defects in the manufacturing of silicon integrated circuits. Increasing capital investment in manufacturing is forcing us toward processes and equipment that are effective not only in reduction of the cost of ownership but can also increase the effectiveness of equipment of current as well as future applications. Rapid thermal processing (RTP) based on incoherent light as the source of energy is playing an important role in the manufacturing of 300 nm and larger diameter wafers. The dominance of ultraviolet and vacuum ultraviolet photons in RTP results in rapid photothermal processing (RPP). The results presented in this paper show that the materials and devices processed by RPP are better than those processed by other thermal processes. This paper discusses the manufacturing science, operating principles of RPP and experimental results supporting its role in future process integration

Keywords

integrated circuit technology; rapid thermal processing; Si; UV photons; VUV photons; cost of ownership; manufacturing; process integration; rapid photothermal processing; silicon integrated circuit; single wafer processing; Elementary particle vacuum; Furnaces; Kelvin; Light sources; Manufacturing processes; Microscopy; Pulp manufacturing; Rapid thermal processing; Temperature; Thermal stresses;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.661226

Filename

661226