DocumentCode
1341286
Title
Effectiveness of SEL Hardening Strategies and the Latchup Domino Effect
Author
Dodds, N.A. ; Hooten, N.C. ; Reed, R.A. ; Schrimpf, R.D. ; Warner, J.H. ; Roche, N. J -H ; McMorrow, D. ; Wen, S. -J ; Wong, R. ; Salzman, J.F. ; Jordan, S. ; Pellish, J.A. ; Marshall, C.J. ; Gaspard, N.J. ; Bennett, W.G. ; Zhang, E.X. ; Bhuva, B.L.
Author_Institution
Vanderbilt Univ., Nashville, TN, USA
Volume
59
Issue
6
fYear
2012
Firstpage
2642
Lastpage
2650
Abstract
Heavy ion, neutron, and laser experimental data are used to evaluate the effectiveness of various single event latchup (SEL) hardening strategies, including silicon-on-insulator (SOI), triple well, and guard rings. Although SOI technology is widely reported to be immune to SEL, conventional pnpn latchup can occur and has been observed in non-dielectrically isolated SOI processes. Triple well technologies are shown to be more robust against SEL than dual well technologies under all conditions used in this study, suggesting that the introduction of a deep N-well is an excellent zero-area-penalty hardening strategy. A single guard ring is shown to be sufficient for SEL immunity in the 180 nm CMOS technology investigated, and is likely sufficient for more modern CMOS technologies. After triggering latchup in a certain pnpn region, latchup was observed to spread to neighboring pnpn regions, which then infected other more distant regions until it had spread over a total distance of 700 micrometers. We discuss the physical mechanism of this latchup domino effect and its implications for device characterization and hardness assurance.
Keywords
CMOS logic circuits; isolation technology; laser beam effects; neutron effects; p-n junctions; radiation hardening (electronics); semiconductor junctions; silicon-on-insulator; trigger circuits; CMOS technology; SEL hardening strategies; SEL immunity; SOI technology; conventional pnpn latchup; deep N-well; device characterization; dual well technologies; guard rings; hardness assurance; laser experimental data; latchup domino effect; nondielectrically isolated SOI processes; physical mechanism; pnpn region; silicon-on-insulator; single event latchup hardening strategies; size 180 nm; triggering latchup; triple well technologies; zero-area-penalty hardening strategy; CMOS technology; Radiation hardening; Silicon on insulator technology; Guard ring; SOI; SRAM; hardened by design; hardened by process; latchup spreading; latchup test structure; single event latchup; triple well;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2012.2224374
Filename
6365392
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