• DocumentCode
    1341529
  • Title

    Increased Single-Event Transient Pulsewidths in a 90-nm Bulk CMOS Technology Operating at Elevated Temperatures

  • Author

    Gadlage, Matthew J. ; Ahlbin, Jonathan R. ; Narasimham, Balaji ; Ramachandran, Vishwanath ; Dinkins, C.A. ; Pate, N.D. ; Bhuva, Bharat L. ; Schrimpf, Ronald D. ; Massengill, Lloyd W. ; Shuler, Robert L. ; McMorrow, Dale

  • Author_Institution
    Vanderbilt Univ., Nashville, TN, USA
  • Volume
    10
  • Issue
    1
  • fYear
    2010
  • fDate
    3/1/2010 12:00:00 AM
  • Firstpage
    157
  • Lastpage
    163
  • Abstract
    Combinational-logic soft errors are expected to be the dominant reliability issue for advanced technologies. One of the major factors affecting the soft-error rates is single-event transient (SET) pulsewidths. The SET pulsewidths, which are controlled by drift, diffusion, and parasitic bipolar-transistor parameters, are a strong function of operating temperature. In this paper, heavy-ion induced SET pulsewidths are reported at temperatures ranging from 25??C to 100??C, as measured with an autonomous SET capture circuit. Experimental and simulation results in a 90-nm bulk CMOS technology indicate an increase of as high as 37% in measured average SET pulsewidth with increasing operating temperature, with some pulses almost 2 ns long at higher temperatures. The increase in the SET pulsewidth can be explained by the dependence of parasitic bipolar-transistor characteristics on temperature.
  • Keywords
    CMOS logic circuits; bipolar transistors; combinational circuits; integrated circuit reliability; radiation hardening (electronics); autonomous SET capture circuit; bulk CMOS technology; combinational-logic soft errors; elevated temperatures; heavy-ion induced SET pulsewidths; parasitic bipolar-transistor parameters; single-event transient pulsewidths; size 90 nm; soft-error rates; temperature 25 degC to 100 degC; Ion radiation effects; single-event transient (SET); single-event upset; soft-error rate;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2009.2036719
  • Filename
    5340671