DocumentCode
1341679
Title
Bias Influence on Corrosion of Plastic Encapsulated Device Metal Systems
Author
Reich, Bemard
Author_Institution
US Army Electronics Technology & Devices Lab.//ATTN: DRSEL-TL-DS//Fort Monmouth, NJ 07703 USA.
Issue
5
fYear
1976
Firstpage
296
Lastpage
298
Abstract
Because of apparent anomalies noted on data recorded in tests conducted on PEDs (plastic encapsulated device) a re-examination of the influence of voltage biasing in temperature-humidity-bias testing has been conducted. Applied bias can have an important influence on the reliability of plastic encapsulated transistors, depending on how it is applied. The analysis presented in this paper on the role of bias influence on PED failure rate explains some of the discrepancies that have been noted in the past by the author and other investigators.
Keywords
Aluminum; Circuit testing; Corrosion; Gold; Metallization; Plastics; Stress; System testing; Voltage; Wire; Failure rate data; Operating tests; Plastic encapsulation; Temperature-humidity-bias test; Test data; Transistors;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/TR.1976.5220014
Filename
5220014
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