• DocumentCode
    1341679
  • Title

    Bias Influence on Corrosion of Plastic Encapsulated Device Metal Systems

  • Author

    Reich, Bemard

  • Author_Institution
    US Army Electronics Technology & Devices Lab.//ATTN: DRSEL-TL-DS//Fort Monmouth, NJ 07703 USA.
  • Issue
    5
  • fYear
    1976
  • Firstpage
    296
  • Lastpage
    298
  • Abstract
    Because of apparent anomalies noted on data recorded in tests conducted on PEDs (plastic encapsulated device) a re-examination of the influence of voltage biasing in temperature-humidity-bias testing has been conducted. Applied bias can have an important influence on the reliability of plastic encapsulated transistors, depending on how it is applied. The analysis presented in this paper on the role of bias influence on PED failure rate explains some of the discrepancies that have been noted in the past by the author and other investigators.
  • Keywords
    Aluminum; Circuit testing; Corrosion; Gold; Metallization; Plastics; Stress; System testing; Voltage; Wire; Failure rate data; Operating tests; Plastic encapsulation; Temperature-humidity-bias test; Test data; Transistors;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.1976.5220014
  • Filename
    5220014