DocumentCode :
1342201
Title :
High-Resolution Capacitive Microinclinometer With Oblique Comb Electrodes Using (110) Silicon
Author :
Jeong, Dae-Hun ; Yun, Sung-Sik ; Lee, Byung-Geun ; Lee, Myung-Lae ; Choi, Chang-Auk ; Lee, Jong-Hyun
Author_Institution :
Sch. of Inf. & Mechatron., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
Volume :
20
Issue :
6
fYear :
2011
Firstpage :
1269
Lastpage :
1276
Abstract :
We propose a new capacitive microinclinometer where oblique comb electrodes and double-folded suspension springs are aligned parallel to the vertical (111) plane of (110) silicon. The oblique comb utilizes both the overlapped area and the gap between movable and stationary electrodes, resulting in a considerable increase in sensitivity (capacitance change/angle). The resolution becomes even higher by taking advantage of the smooth (111) sidewalls of the oblique comb electrodes, which are fabricated using silicon deep reactive ion etching followed by crystalline wet etching. The surface roughness was reduced from 200 (Rrms) to 20 nm (Rrms), and the verticality was improved from 88.7° to 89.7°. The capacitance change of the fabricated inclinometer experimentally ranges from -0.793 to 0.783 pF for the full range of inclination angle (from -90° to 90°). The estimated worst resolution, which is obtainable at an inclination angle of ±85°, was as low as 0.25°.
Keywords :
capacitance measurement; elemental semiconductors; micromechanical devices; silicon; springs (mechanical); sputter etching; surface roughness; suspensions (mechanical components); Si; capacitive microinclinometer; crystalline wet etching; double-folded suspension springs; inclination angle; movable electrodes; oblique comb electrodes; overlapped area; silicon deep reactive ion etching; stationary electrodes; surface roughness; vertical (111) plane; Capacitance; Electrodes; Springs; Suspensions; Wet etching; (110) silicon; Capacitive inclinometer; crystalline wet etching; high resolution; oblique comb electrode;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2011.2167662
Filename :
6035945
Link To Document :
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