• DocumentCode
    1342201
  • Title

    High-Resolution Capacitive Microinclinometer With Oblique Comb Electrodes Using (110) Silicon

  • Author

    Jeong, Dae-Hun ; Yun, Sung-Sik ; Lee, Byung-Geun ; Lee, Myung-Lae ; Choi, Chang-Auk ; Lee, Jong-Hyun

  • Author_Institution
    Sch. of Inf. & Mechatron., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
  • Volume
    20
  • Issue
    6
  • fYear
    2011
  • Firstpage
    1269
  • Lastpage
    1276
  • Abstract
    We propose a new capacitive microinclinometer where oblique comb electrodes and double-folded suspension springs are aligned parallel to the vertical (111) plane of (110) silicon. The oblique comb utilizes both the overlapped area and the gap between movable and stationary electrodes, resulting in a considerable increase in sensitivity (capacitance change/angle). The resolution becomes even higher by taking advantage of the smooth (111) sidewalls of the oblique comb electrodes, which are fabricated using silicon deep reactive ion etching followed by crystalline wet etching. The surface roughness was reduced from 200 (Rrms) to 20 nm (Rrms), and the verticality was improved from 88.7° to 89.7°. The capacitance change of the fabricated inclinometer experimentally ranges from -0.793 to 0.783 pF for the full range of inclination angle (from -90° to 90°). The estimated worst resolution, which is obtainable at an inclination angle of ±85°, was as low as 0.25°.
  • Keywords
    capacitance measurement; elemental semiconductors; micromechanical devices; silicon; springs (mechanical); sputter etching; surface roughness; suspensions (mechanical components); Si; capacitive microinclinometer; crystalline wet etching; double-folded suspension springs; inclination angle; movable electrodes; oblique comb electrodes; overlapped area; silicon deep reactive ion etching; stationary electrodes; surface roughness; vertical (111) plane; Capacitance; Electrodes; Springs; Suspensions; Wet etching; (110) silicon; Capacitive inclinometer; crystalline wet etching; high resolution; oblique comb electrode;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2167662
  • Filename
    6035945