DocumentCode :
1342341
Title :
An SCR-Incorporated BJT Device for Robust ESD Protection With High Latchup Immunity in High-Voltage Technology
Author :
Huang, Chih-Yao ; Chiu, Fu-Chien ; Chen, Quo-Ker ; Lai, Ming-Fang ; Tseng, Jen-Chou
Author_Institution :
Dept. of Electron. Eng., Ching Yun Univ., Jungli, Taiwan
Volume :
12
Issue :
1
fYear :
2012
fDate :
3/1/2012 12:00:00 AM
Firstpage :
113
Lastpage :
123
Abstract :
A silicon-controlled rectifier (SCR)-incorporated BJT with high holding voltage is developed for electrostatic discharge (ESD) protection in a 0.6 μm high-voltage 10 V process. This device consists simply of a floating P+ diffusion incorporated in a parasitic NPN BJT. A robust 6-7 kV ESD threshold and high-latchup-immune holding voltage of 15-18 V can be achieved by layout optimization of the NPN-N+ -collector to floating P+ -diffusion spacing and the floating P+ diffusion width. It can be equivalently regarded as parallel connection of an incorporated PNPN SCR part and an NPN BJT part. The incorporated SCR part is further composed of a parasitic SCR in series with a reverse-biased PN diode formed by the floating P+ region and N-well. The further analysis shows that the floating P+ diffusion is the key part of this SCR-incorporated BJT. The parasitic reverse-biased PN diode sustains most of the high holding voltage. The parasitic NPN BJT plays a major role in ESD current conduction, while the incorporated SCR in series with the reverse-biased PN diode is the secondary conduction path.
Keywords :
bipolar transistors; electrostatic discharge; power semiconductor diodes; thyristors; ESD current conduction; PNPN SCR part; SCR-incorporated BJT device; electrostatic discharge protection; floating diffusion spacing; high-latchup immunity holding voltage; high-voltage technology; layout optimization; parasitic NPN BJT; parasitic reverse-biased PN diode; robust ESD protection; silicon-controlled rectifier; size 0.6 mum; voltage 10 V; voltage 15 V to 18 V; voltage 6 kV to 7 kV; Anodes; Electrostatic discharge; Integrated circuits; Layout; Resistance; Robustness; Thyristors; BJT; electrostatic discharge (ESD); holding voltage; junction; latchup; silicon-controlled rectifier (SCR);
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2011.2170839
Filename :
6035964
Link To Document :
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