Title :
Fin-Width Dependence of Ionizing Radiation-Induced Subthreshold-Swing Degradation in 100-nm-Gate-Length FinFETs
Author :
El Mamouni, Farah ; Zhang, En Xia ; Schrimpf, Ronald D. ; Fleetwood, Daniel M. ; Reed, Robert A. ; Cristoloveanu, Sorin ; Xiong, Weize
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
Abstract :
The dependence of the subthreshold-swing (SS) degradation on fin width is reported for irradiated 100-nm-gate- length, fully depleted n -channel FinFETs. The wider the fin is, the greater the radiation-induced SS degradation. The higher tolerance to radiation-induced charge for the narrower FinFETs is attributed to the additional lateral gate control over the body potential. The irradiation and room temperature annealing results suggest that the SS increase for wider FinFETs is due primarily to nonuniform trapped charge in the buried oxide (BOX). The subthreshold characteristics of FinFETs with two fins are more likely to exhibit a nonuniform subthreshold slope (NUSS), resulting from fin-to-fin variability, than FinFETs with 20 fins, where the corresponding Id -V gs curve is the composite of the 20 individual Id-V gs curves.
Keywords :
MOSFET; annealing; electron traps; hole traps; radiation effects; silicon-on-insulator; Si; buried oxide; depleted n -channel FinFET; fin-width dependence; gate-length FinFET; ionizing radiation-induced subthreshold-swing degradation; lateral gate control; nonuniform subthreshold slope; radiation-induced charge; room temperature annealing; silicon-on-insulator; size 100 nm; subthreshold characteristics; temperature 293 K to 298 K; trapped charge; Annealing; Degradation; FinFETs; Ionizing radiation; MOSFETs; Random access memory; Scanning electron microscopy; Silicon on insulator technology; Temperature; Threshold voltage; Annealing; buried oxide (BOX); fin width; fully depleted (FD) FinFETs; silicon-on-insulator (SOI); subthreshold swing (SS); total ionizing dose (TID);
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2009.2034155