DocumentCode
1343002
Title
Design considerations for high-data-rate chip interconnect systems
Author
Beukema, Troy
Author_Institution
IBM
Volume
48
Issue
10
fYear
2010
fDate
10/1/2010 12:00:00 AM
Firstpage
174
Lastpage
183
Abstract
Over the past decade, data rates for electrical interconnects in interchip communications systems have experienced a dramatic increase from <;1 Gb/s to 10 Gb/s and beyond to keep up with ever increasing demands for more I/O bandwidth from modern high-capacity storage, networking, and data processing systems. This article presents an overview of the high-data-rate chip interconnect design space, including a short description of the channel, line equalization architecture, and design considerations for key I/O core subsystems realized in nanoscale CMOS technology.
Keywords
CMOS integrated circuits; integrated circuit interconnections; microprocessor chips; CMOS technology; I/O core subsystems; channel line equalization; electrical interconnects; high-data rate chip interconnect systems; interchip communications systems; CMOS integrated circuits; Crosstalk; Integrated circuit interconnections; Phase locked loops; Receivers; Reflection; Transmitters;
fLanguage
English
Journal_Title
Communications Magazine, IEEE
Publisher
ieee
ISSN
0163-6804
Type
jour
DOI
10.1109/MCOM.2010.5594694
Filename
5594694
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