Title :
Transient analysis of mixed carbon nanotube bundle interconnects
Author :
Sathyakam, P. Uma ; Mallick, P.S.
Author_Institution :
Sch. of Electr. Eng., VIT Univ., Vellore, India
Abstract :
Presented for the first time is an accurate modelling hierarchy for mixed CNT bundle interconnects. Single-walled CNTs and multi-walled CNTs have been modelled as equivalent single conductor transmission lines and then combined to form a mixed CNT bundle interconnect, which is basically a multiple equivalent single conductor model. Two multiple equivalent single conductor interconnects have been taken to form the multiconductor transmission line model. The delays from transient analysis for both models for a unit bundle have been compared with the corresponding ones for SWCNT bundles and MWCNTs that exist in the literature. It is found that mixed CNT bundle interconnects are superior to both SWCNT bundle and MWCNT interconnects in terms of delay.
Keywords :
carbon nanotubes; integrated circuit interconnections; transient analysis; C; MWCNT interconnects; SWCNT bundles; conductor model; delay; mixed CNT bundle interconnects; mixed carbon nanotube bundle interconnects; multiconductor transmission line model; multiwalled CNT; single-walled CNT; transient analysis;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2011.1705