• DocumentCode
    1343387
  • Title

    A Study of Accelerated Storage Test Conditions Applicable to Semiconductor Devices and Microcircuits

  • Author

    Reich, Bernard

  • Author_Institution
    DRSEL-TL-DS; US Army Electronics Command; Fort Monmouth, NJ 07703 USA.
  • Issue
    3
  • fYear
    1978
  • Firstpage
    178
  • Lastpage
    180
  • Abstract
    This preliminary theoretical study on the application of accelerated stress testing for determining storage life of semiconductor devices and microcircuits has resulted in the following conclusions: There are more environmental stresses that can be applied to the accelerated testing of plastic encapsulated microcircuits, than hermetic devices. For hermetic devices, the assurance of initial hermeticity and wire bond integrity should insure long storage-dormancy life. Since only limited storage-dormancy data are available, accelerated testing and verification with use conditions data are necessary to support the conclusion of this study.
  • Keywords
    Electronic equipment testing; Life estimation; Life testing; Plastics; Reliability theory; Semiconductor device reliability; Semiconductor device testing; Semiconductor devices; Stress; Temperature; Accelerated tests; Microcircuits; Storage environment; Storage reliability;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.1978.5220315
  • Filename
    5220315