Title :
Cyclic Magnetic Actuation for Potential Characterization of Interfacial Fatigue Fracture
Author :
Zheng, Jiantao ; Ostrowicki, Gregory ; Sitaraman, Suresh K.
Author_Institution :
Comput.-Aided Simulation of Packaging Reliability (CASPaR) Lab., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
An innovative fixtureless test technique to study interfacial fatigue fracture in thin film stacks is proposed and implemented. Cyclic noncontact magnetic actuation is employed to supply the fatigue crack driving force along the interface between a released metal thin film cantilever and the supporting substrate. In-situ crack growth measurements with nanometer resolution are possible through electrical resistance monitoring of nanoscale metal traces that are located along the edge of the delaminating interface. Ti/Au nano metal traces are fabricated using electron-beam lithography and characterized to show stable electrical behavior. The fatigue test results were then used to assess the reliability of micro contact springs under fatigue loading for wafer probing applications.
Keywords :
cantilevers; delamination; electromagnetic actuators; electron beam lithography; fatigue cracks; fatigue testing; reliability; thin films; titanium; IEEE nanometer resolution; Ti-Au; cyclic magnetic actuation; cyclic noncontact magnetic actuation; electrical resistance monitoring; electron-beam lithography; fatigue crack; fatigue test; in-situ crack growth measurements; innovative fixtureless test technique; interface delamination; interfacial fatigue fracture; metal thin film cantilever; microcontact spring reliability; nanoscale metal traces; thin film stacks; wafer probing; Electrical resistance measurement; Fatigue; Metals; Nanoscale devices; Resistance; Springs; Substrates; Experimental characterization; fatigue crack propagation; interfacial delamination;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2010.2058113
