• DocumentCode
    1344477
  • Title

    18-GHz 3.65-W/mm Enhancement-Mode AlGaN/GaN HFET Using Fluorine Plasma Ion Implantation

  • Author

    Feng, Z.H. ; Zhou, R. ; Xie, S.Y. ; Yin, J.Y. ; Fang, J.X. ; Liu, B. ; Zhou, W. ; Chen, Kevin J. ; Cai, S.J.

  • Author_Institution
    Nat. Key Lab. of Applic. Specific Integrated Circuit, Hebei Semicond. Res. Inst., Shijiazhuang, China
  • Volume
    31
  • Issue
    12
  • fYear
    2010
  • Firstpage
    1386
  • Lastpage
    1388
  • Abstract
    Enhancement-mode (E-mode) AlGaN/GaN heterojunction field effect transistors (HFETs) with a nominal gate length of 0.35 μm are fabricated on a SiC substrate by fluorine plasma ion implantation without the use of gate recess. The threshold voltage is measured to be +0.2 V by linear extrapolation from the transfer characteristics. The E-mode device exhibits a saturation drain current density of 735 mA/mm at a gate bias of 4 V, a peak transconductance of 269 mS/mm, a current-gain cutoff frequency (fT) of 39 GHz, and a maximum oscillation frequency (fmax) of 91 GHz. At 18 GHz, the fabricated E-mode device exhibits a maximum output power density of 3.65 W/mm, a linear gain of 11.6 dB, and a peak power-added efficiency of 42%. This is the first report of the large-signal performance of AlGaN/GaN E-mode HFETs in the Ku-band.
  • Keywords
    III-V semiconductors; aluminium compounds; current density; gallium compounds; ion implantation; microwave field effect transistors; wide band gap semiconductors; AlGaN-GaN; Ku-band; current-gain cutoff frequency; enhancement-mode HFET; fluorine plasma ion implantation; frequency 18 GHz; gate bias; gate length; gate recess; heterojunction field effect transistors; linear extrapolation; maximum output power density; oscillation frequency; peak power-added efficiency; saturation drain current density; threshold voltage; transconductance; voltage 4 V; Aluminum gallium nitride; Cutoff frequency; Gallium nitride; HEMTs; Logic gates; MODFETs; Plasmas; AlGaN/GaN; Ku-band; enhancement-mode (E-mode); fluorine plasma ion implantation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2072901
  • Filename
    5595488